New Step by Step Map For Noohapou
New Step by Step Map For Noohapou
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The POU3500 procedure gives dynamic temperature Charge of the procedure chamber cathode / electrode / anode and will be synchronized with any etch method.
Resource & TCU application calibration strategies change exterior examination devices not utilised consistently for verifying
the data below is classified by semiconductor process and Resource company. Each table includes an apps Matrix that shows qulified and professional processes.
at first Started in 1985, our organization has developed right into a regarded chief in offering temperature Manage techniques to the worldwide semiconductor marketplace.
LAUDA-Noah will, for your shopper's retrofit analysis, observe and modify its fluid temperature Command profiles to match an current TCUs' to be able to ensure a easy procedure integration via DAQ.
The accuracy of the POU 3300 permits independent control of the method fluid temperature into the wafer chuck inside of +/- 0.1 °C of established level, as well as speedy reaction time from the process makes it possible for for max wafer-to-wafer repeatability all through the etch course of action.
The precision in the POU 3500 permits independent control of the method fluid temperature on the wafer chuck inside of +/- 0.1 °C of set place, plus the fast reaction time of your method allows for optimum wafer-to-wafer repeatability all through the etch method.
With our device strategically mounted close to 6 feet through the chamber, we reach a way more correct studying of your chuck temperature. This approach assures consistent temperature through the entire manufacturing whole lot, resulting in improved wafer-to-wafer CD uniformity.
huge Footprint: Static models occupy significant Room throughout the fabrication Software location, reducing its efficiency.
LAUDA-Noah is Conference these new troubles and it has integrated Electricity conserving technological innovation in systems which might be friendly to the atmosphere and possess a low cost to function.
the information set here is from a 200mm volume production wafer fab and Evidently illustrates the benefit of the LAUDA-Noah POU procedure.
greater than at any time, shrinking device geometries, demanding new processes along with a remarkably competitive atmosphere call for temperature Regulate devices that combine speedy and exact temperature Regulate using an emphasis on decreased functioning fees and enhanced dependability.
Confirmed; TEs' depict just one Component of a chiller's style and design. The switching & Command methods utilized by a chiller will impression the TEs' dependability.
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We involve significantly less cooling/heating capacity for a similar software like a get more info static TCU because of our compact reservoir volume.
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